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Chip Quik, Inc. BGA0001-S

BGA0001-S

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Part Number:BGA0001-S
Manufacturer:Chip Quik, Inc.
Description:STENCIL BGA-100 .8MM
Category:Soldering, Desoldering, Rework Products
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Learn more about Chip Quik, Inc. BGA0001-S
Stencil Selection Guilde
Circuit Assembly Instr
BGA0001-S
  • Specifications
  • Type:BGA
  • Thickness:0.0040" (0.102mm)
  • Thermal Center Pad:-
  • Series:Proto-Advantage
  • Pitch:0.031" (0.80mm)
  • Outer Dimension:0.900" L x 1.300" W (22.86mm x 33.02mm)
  • Other Names:BGA0001S
  • Number of Positions:100
  • Moisture Sensitivity Level (MSL):1 (Unlimited)
  • Material:Stainless Steel
  • Manufacturer Standard Lead Time:2 Weeks
  • Lead Free Status / RoHS Status:Lead free / RoHS Compliant
  • Inner Dimension:-

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